Ag
Cu
各種メッキ
ファイン回路印刷とは超小型電子部品用の回路印刷技術です。近年、エレクトロニクス機器の小型化・軽量化・高性能化が進むにつれて、 基板回路パッケージも多実装・高密度の要求が高まっています。 こうした要求に答えるため、更なる繊細パターンの印刷技術を展開しています。
◆特長
・アルミナセラミックス基板の特性
・微細配線 L/S:50μm、50μm 印刷可能
・高密度配線可能
・小型化
◆用途
・アンテナモジュール
・発振子
・各種センサー基板
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